Effect of mechanical treatment type on the strength of undoped single crystal indium antimonide wafers


	Specimen loading patterns ((a) three-point and (b) four-point) and bending moment curves for plane transverse bending method.

Part of: Kormilitsina SS, Molodtsova EV, Knyzev SN, Kozlov RYu, Zavrazhin DA, Zharikova EV, Syrov YuV (2020) Effect of mechanical treatment type on the strength of undoped single crystal indium antimonide wafers. Modern Electronic Materials 6(4): 147-153. https://doi.org/10.3897/j.moem.6.4.64991