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Research Article
Modern Electronic Materials 6(3): 77-84
https://doi.org/10.3897/j.moem.6.3.63224 (30 Sep 2020)
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    Microstructural impact on electromigration reliability of gold interconnects. Solid-State Electronics 200: 108528. CrossRef DOI: 10.1016/j.sse.2022.108528
  • H. Ceric, R.L. de Orio, S. Selberherr (2023)
    Statistical study of electromigration in gold interconnects. Microelectronics Reliability 147: 115061. CrossRef DOI: 10.1016/j.microrel.2023.115061
  • Hajdin Ceric, Roberto Lacerda de Orio, Siegfried Selberherr (2022)
    Impact of Gold Interconnect Microstructure on Electromigration Failure Time Statistics. ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC) : 301. CrossRef DOI: 10.1109/ESSDERC55479.2022.9947168
  • H. Ceric, R. L. de Orio, S. Selberherr (2022)
    Electromigration Degradation of Gold Interconnects: A Statistical Study. 2022 IEEE International Interconnect Technology Conference (IITC) : 102. CrossRef DOI: 10.1109/IITC52079.2022.9881313
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